FLEX

CIRCUITS

Our Technology Road Map

When you engage Minco early in the design cycle, our team of highly trained engineers can introduce design insights that help reduce risk, minimize cost and increase solution reliability. Our proprietary New Product Introduction (NPI) approach allows for upfront design and manufacture analysis, followed by a process risk analysis step to promote fewer product iterations and minimize delays.

Time-Tested Processes Speed Timelines and Protect Quality

 Description Rigid Flex
Multilayer, Dbl Layer
& Single Layer
HDI
 Min. drilled via finished dia. .008" .008" n/a
 Min. laser via formed dia. .003 .003" 75μm
 Min. line and spacing .003"/.003"
.003"/.003" 50μm /50μm
 Min. copper thickness
9 Micron
9 Micron
9 Micron
 Max copper thickness
< 2 oz
< 4oz < 1oz
 Min. pad size for thru-hole vias
Via dia. + .015"
Via dia. + .015"
n/a
 Min. pad size for micro vias
N/A Via dia. + .006
Via dia. + .006
 Panel Size
18" by 24"
18" by 24"
18" by 24"
 Thru hole plating aspect ratio
10:1 10:1 4:1
 Blind micro via min. plating aspect ratio
- 1:1 1:1
 Panel plating
yes yes
yes
 Selective plating
yes yes
yes
 Number of layers
12+ 1-10 2-6
 Via fill
Copper filled
Copper filled
Copper filled

Looking for a customized circuit solution?

Our engineers are ready to help.

Ready to initiate a project?

Use this new flex project worksheet to get started.

ALL FLEX CIRCUIT SOLUTIONS

SINGLE & DOUBLE
LAYER FLEX

SINGLE & DOUBLE
LAYER FLEX

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CUSTOM FUNCTIONALITY

CUSTOM FUNCTIONALITY

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OUR TECHNOLOGY ROAD MAP

OUR TECHNOLOGY ROAD MAP

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