TEST REPORT: Multilayer HDI Flex Circuits

High Reliability Microvias in 12" x 24" (305 x 610 mm) Panel Size

HDI is the incorporation of microvias and fine features to achieve more highly dense flex circuitry, smaller form factor, and increased functionality. HDI technology offers better electrical performance, access to advanced integrated circuit (IC) package use, and improved reliability through the use of microvias and thinner materials.

The microvia is the backbone of HDI technology, thus, the focus of this test report is microvia reliability; highlighting microvia formation, metallization, and registration performance. In addition, advanced equipment used to achieve tight registration as well as the benefits of large panel sizes are addressed.