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Hello there, Anyone have involved to this project? I wonder the arrangement of the interface between DUT, heater, heatsink, and the temperature sensor. Is there any established plant for this ATCS focusing to the IC?

So far as I have experienced, any ATCS for IC packages is far more concerned about heat removal, not the addition of heat to the IC. There is more of a focus on good heatsinking with active cooling elements. High performance systems may use thermoelectric cooling modules. Overclockers can go to more exotic lengths like liquid nitrogen cooling.

I have heard of thin heaters used in testing and simulating the heating load produced by advanced ICs for development of cooling systems.

If you have other experience with the need for heating the IC, could you explain further?

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Vitreous Humor
"Eye can see clearly now..."

This method actually apply into the testing field. What I know, this type of application desired for fast response temperature to test the ic instead of leave  the IC heat itself. It has been implement  to reduce the time in manufacturing testing process. But i still wonder the specific apparatus eg: types heater, mounted style,cooling element and heatsink type... Hopefully anyone could make me clear.. Thanks. 

An IC can be thermally cycled by using a metal heatsink of good thermal conductivity with a raised central area the size of the die for direct contact. A thin heater is able to be bonded to the peripheral area of the heat sink and a thermoelectric element can be attached to the opposite side for both heating and cooling. A very small, fast response temperature sensor is able to be inserted into the raised portion of the heatsink for control purposes.

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Vitreous Humor
"Eye can see clearly now..."